![]() What Is Being Verified? Functional Verification Approaches. 1: What is Verification? What is a Testbench? The Importance of Verification. Reuse Methodology Manual for System-On-A-Chip Designs, Second Edition will be updated on a regular basis as a result of changing technology and improved insight into the problems of design reuse and its role in producing high-quality SoC designs.Ībout the Cover. Instead, this manual is an attempt to capture and incrementally improve on current best practices in the industry, and to give a coherent, integrated view of the design process. Silicon and tool technologies move so quickly that no single methodology can provide a permanent solution to this highly dynamic problem. Reuse Methodology Manual for System-On-A-Chip Designs, Second Edition outlines an effective methodology for creating reusable designs for use in a System-on-a-Chip (SoC) design methodology. Design reuse - the use of pre-designed and pre-verified cores - is the most promising opportunity to bridge the gap between available gate-count and designer productivity. Tools are not providing the productivity gains required to keep pace with the increasing gate counts available from deep submicron technology. There is considerable pressure to keep design team size and design schedules constant even as design complexities grow. These designers see current design tools and methodologies as inadequate for developing million-gate ASICs from scratch. As a result, many ASIC developers and silicon vendors are re-examining their design methodologies, searching for ways to make effective use of the huge numbers of gates now available. This technology not only promises new levels of system integration onto a single chip, but also presents significant challenges to the chip designer. Silicon technology now allows us to build chips consisting of tens of millions of transistors. This flow allows us to extract accurate power and area results for each design point As a result, to study the design tradeoffs, I use an approach that utlizes an RTL implementation, combined with a custom design exploration flow built on top of production quality CAD tools. Rigel is an agressive design target and requires us to focus on the area and power impact of the memory model design choices. I will study the memory model design tradeoffs of the Rigel cluster, a subblock of the Rigel architecure, and attempt to propose a design configuration that is suitable to the unique requirements of the Rigel architecture. This thesis will focus on Rigel, a 1024core, general purpose massively parallel architecure. The increased popularity of massively parallel architectures has motivated researchers to further examine the memory model tradeoffs these types of architectures and their target applications present. There are many design choices and tradeoffs to be considered, and these often need to be tightly coupled to the processing unit’s arcitecure. ![]() Memory model design is a major part of any modern processor architecture. It is highly suitable for industrial applications such as multi-axis robots, that require several driving channels to run simultaneously. The proposed algorithm can be used for both soft- or hard-chopping switching strategies. All of the above said shows that programmable logic devices outperform the capabilities of most if not any conventional microcontroller available on the market. Moreover the PWM resolution can be easily configured to a non-trivial value such as 9 or 13 bits upon design requirements. Because of the physical specifics of the different power transistors the dead time duration can be easily configured via parameters. This is made possible with the aid of a programmable logic device which inherent ability for parallel algorithm execution permits to implement multiple Pulse Width Modulator (PWM) devices on a single chip. A possible solution to the problem is proposed in the paper that injects the so called “interlock delay time” or a “dead time” into the control algorithm. The ensuing effect can generate unwanted losses or cause thermal runaway and the result will be a failure of the power switch and even of the whole inverter. This situation emerges when the upper and the lower switch from the same side of the bridge are both in on state for some time. Such applications include full H-bridge power stages which are prone to shoot through if not properly driven. In nowadays industry the voltage source inverters with MOSFET or IGBT devices are used more and more frequently.
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